MediaTek has unveiled the Dimensity 7200 Ultra, an upgraded version of its Dimensity 7200 SoC, in China. Fabricated using TSMC’s 4nm process, this chipset offers support for up to 200MP cameras, among other features. Below, we delve into the specifics of this chipset.
Details About MediaTek Dimensity 7200 Ultra
The Dimensity 7200 Ultra features an octa-core configuration, which includes 2 Arm Cortex-A715 cores clocked at up to 2.8GHz and 6 Cortex-A510 cores, mirroring the structure of the Dimensity 7200 chipset.
In the graphics department, it is equipped with the Arm Mali-G610 GPU, complemented by the AI APU 650 to deliver a balanced performance with low power consumption. For photography enthusiasts, the chipset boasts a 14-bit HDR-ISP, Imagiq 765, support for cameras up to 200MP, and 4K video recording at 30 fps. Additionally, it supports displays with refresh rates of up to 144Hz, incorporates a 5G modem, and offers other impressive features.
Xiaomi has already confirmed that the Redmi Note 13 Pro+ will be among the first smartphones to be powered by the Dimensity 7200 Ultra.
The Redmi Note 13 Pro+ is expected to feature a remarkable 200MP main camera with an ISOCELL sensor, enhanced by Xiaomi’s proprietary image processing algorithm for superior image clarity and impressive zoom capabilities. Additionally, the smartphone is anticipated to sport a 120Hz display, support for up to 120W fast charging, and other noteworthy features.
While Xiaomi’s Weibo post suggests a launch sometime this month, an exact date has not yet been confirmed. Further updates regarding the launch date will be provided as they become available. Stay tuned for more information.
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